Method and apparatus for cooling a portable computer

ABSTRACT

A portable computer includes a housing containing a circuit component, and a temperature adjusting arrangement which has a thermally conductive section with a side facing approximately along an axis and thermally coupled to the component. A fluid supply section directs a fluid flow along the axis and the thermally conductive section splits the fluid flow into a plurality of flow portions which each flow through the thermally conductive section in a direction approximately parallel to a plane perpendicular to the axis, the flow portions exiting the thermally conductive section at a plurality of respective locations disposed along a substantial portion of the periphery of the thermally conductive section.

TECHNICAL FIELD OF THE INVENTION

This invention relates in general to techniques for cooling circuitdevices and, more particularly, to techniques for cooling circuitdevices disposed within a portable computer.

BACKGROUND OF THE INVENTION

Over the past fifteen years, personal computers have enjoyed aprogressively increasing popularity, including portable computers of thetype commonly known as “laptop” and “notebook” computers. During thissame time period, significant advances have been made in the design ofthe processors used in personal computers, including portable computers.In this regard, the amount of circuitry which can be fabricated in agiven area of an integrated circuit has increased significantly, therebyfacilitating the implementation and fabrication of significantly moresophisticated processor designs. Further, the operational capabilitiesof processors have increased dramatically, and there have also beensignificant increases in the speed at which processors can operate.

A side effect of these technological advances is that state-of-the-artprocessors and other integrated circuits used in personal computersproduce significantly more heat during normal operation than theirpredecessors did only a few years ago. In some systems, the processorsand related components are operated at clock speeds significantly belowtheir maximum rated clock speeds, in order to reduce the amount of heatgenerated, and thus avoid the need to provide active cooling. However,operating the processor at a speed less than its maximum rated speeddecreases the capability of the system, and thus the value of the systemin the eyes of consumers, which is undesirable. Therefore, and focusingspecifically on processor chips, technology has reached a point where,in order to operate a processor at its maximum rated speed whileeffectively dissipating the heat which is generated, it is relativelystandard for a desktop computer to have a forced-air cooling arrangementfor the high-performance processor used in it. In particular, it iscommon to dedicate a relatively large heat sink and/or a powerful fan tothe specific task of cooling the processor of a desktop computer.However, while these cooling arrangements have been generallysatisfactory for use in desktop computers, they are not entirelysatisfactory for use in portable computers.

More specifically, due in part to marketing efforts and consumerpreferences, portable computers have evolved in design to a point wherethey are relatively thin and lightweight. In order to accommodate in aportable computer the type of cooling arrangement that has now becomecommon in desktop computers, there would have to be an increase in boththe thickness and weight of the portable computer. But an increase inthe weight and/or thickness of a portable computer is undesirable from acommercial perspective, because it runs contrary to consumer preferencefor thin and lightweight units. Another significant marketing criteriafor portable computers is the length of time that a fully-chargedbattery can run a portable computer before the battery becomesdischarged. The powerful fans used in many desktop cooling arrangementswould tend to consume a significant amount of battery power if used in aportable computer, and would thus undesirably shorten the effectivebattery life. Although a larger battery could be used, this would resultin an increase in the size and/or weight of the portable computer, whichas discussed above is undesirable.

The above-mentioned cooling arrangements for processors provide littleor no benefit in regard to cooling of other circuit components that areseparate from but associated with the processors. To date, it hastypically not been necessary to provide components other than theprocessor with a direct cooling arrangement. However, advances intechnology have increased the amount of heat generated by these othertypes of components, to the point where more effective coolingtechniques are needed for these components.

Some prior attempts have been made to provide effective cooling inportable computers, but the results have not been entirely satisfactory.For example, heat pipes have been used to conduct heat from an interiorcomponent to an external finned heat sink, but the heat sink addsundesirable weight. Although the additional weight can be reduced tosome extent by making the heat sink from a lightweight material such asmagnesium, magnesium is relatively expensive, and the added expense isundesirable. As another example, some portable computers have ventsprovided in upper and/or lower portions of the housing, in order tofacilitate cooling through natural convection currents. However, thisapproach provides only limited benefit, and technology is reaching apoint where this type of natural convection cooling is simply inadequateto remove the amount of heat that is being generated.

SUMMARY OF THE INVENTION

From the foregoing, it may be appreciated that a need has arisen for amethod and apparatus which facilitate efficient cooling in a portablecomputer. According to the present invention, a method and apparatus areprovided to address this need in a portable computer which includes ahousing containing a circuit component, and involve: thermally couplingto the component a temperature adjusting arrangement which includes athermally conductive section having a side which faces in a directionapproximately parallel to an axis and which is thermally coupled to thecomponent; and directing a fluid flow along the axis toward a side ofthe thermally conductive section opposite from the component, thethermally conductive section causing the fluid flow to split into aplurality of flow portions which each flow through the thermallyconductive section in a direction approximately parallel to a planeperpendicular to the axis, the flow portions exiting the thermallyconductive section at a plurality of respective locations which aredisposed along a substantial portion of the periphery of the thermallyconductive section.

BRIEF DESCRIPTION OF THE DRAWINGS

A better understanding of the present invention will be realized fromthe detailed description which follows, taken in conjunction with theaccompanying drawings, in which:

FIG. 1 is a diagrammatic fragmentary perspective view of a portablecomputer that embodies aspects of the present invention;

FIG. 2 is a diagrammatic fragmentary perspective view of a coolingassembly which is part of the portable computer of FIG. 1;

FIG. 3 is a diagrammatic top view of a finstock which is part of thecooling assembly of FIG. 2;

FIG. 4 is a diagrammatic fragmentary sectional side view of the finstockof FIG. 3;

FIG. 5 is a diagrammatic top view similar to FIG. 3, but showing afinstock which is an alternative embodiment of the finstock shown inFIG. 3;

FIG. 6 is a diagrammatic fragmentary sectional side view similar to FIG.4, but showing an alternative embodiment of the finstock of FIG. 4;

FIG. 7 is a diagrammatic fragmentary perspective view similar to FIG. 2,but showing a cooling assembly which is an alternative embodiment of thecooling assembly of FIG. 2; and

FIG. 8 is a diagrammatic top view similar to FIG. 3, but showing afinstock which is still another alternative embodiment of the finstockshown in FIG. 3.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is a diagrammatic fragmentary perspective view of an apparatuswhich is a portable computer 10, and which embodies aspects of thepresent invention. The computer 10 includes a housing 12 and a lid 13.The lid 13 is pivotally supported on the housing 12 for movement betweenan open position which is shown in FIG. 1, and a closed position inwhich the lid is adjacent the top surface of the housing 12. The lid 13contains a liquid crystal display (LCD) panel 17 of a type commonly usedin portable computers.

A plurality of manually operable keys 18 are provided on top of thehousing 12, and collectively define a computer keyboard. In thedisclosed embodiment, the keyboard conforms to an industry-standardconfiguration, but it could alternatively have some other configuration.The top wall of the housing 12 has, in a central portion thereof, acluster of openings 21 which each extend through the top wall. Theopenings 21 collectively serve as an intake port. The housing 12 alsohas, at an end of the right sidewall which is nearest the lid 13, acluster of openings 22 that collectively serve as a discharge port.Further, the left sidewall of the housing 12 has, near the end remotefrom the lid 13, a cluster of openings 23 that collectively serve as afurther discharge port.

A circuit board 31 is provided within the housing 12. The circuit board31 has a large number of components thereon, but for clarity thesecomponents are not all depicted in FIG. 1. In particular, FIG. 1 showsonly three components 36, 37 and 38, each of which produces heat thatmust be dissipated. The integrated circuit 36 contains ahigh-performance processor, which in the disclosed embodiment is a knowndevice that can be commercially obtained under the trademark PENTIUMfrom Intel Corporation of Santa Clara, Calif. However, the presentinvention is compatible with a wide variety of integrated circuits,including those containing other types of processors.

A cooling assembly 41 is mounted on top of the integrated circuit 36, inthermal communication therewith. The cooling assembly 41 may be mountedon the integrated circuit 36 using a thermally conductive epoxy, or inany other suitable manner that facilitates a flow of heat between theintegrated circuit 36 and the cooling assembly 41. The internalstructure of the cooling assembly 41 is described in more detail later.The cooling assembly 41 has an outwardly projecting tab 42 which isthermally conductive, for a purpose discussed later.

The cooling assembly 41 draws air into the housing 12 through the intakeport defined by the openings 21, as indicated diagrammatically at 43.This air flow passes through the cooling assembly 41, and heat from thecooling assembly 41 is transferred to this air flow. Respective portionsof this air flow exit from the cooling assembly 41 in a variety ofdifferent horizontal directions, and then travel to and through thedischarge port defined by the openings 22 or the discharge port definedby the openings 23. The air flow travels from the cooling assembly 41 tothe discharge ports along a number of different flow paths. Someexamples of these various flow paths are indicated diagrammatically inFIG. 1 by broken lines 45-49. As air flows from the cooling assembly 41to the openings 22 and 23 that define the two discharge ports, the airtravels over and picks up heat from components other than the processor,including the components 37 and 38, as well as other components that arenot specifically shown in FIG. 1.

The pattern of air flow from the cooling assembly 41 to the dischargeports depends on the number of discharge ports, and on where thedischarge ports are located. Further, when there are two or moredischarge ports, the relative sizes of the discharge ports will affectthe pattern of air flow, where the size of each port is the collectivesize of all of the openings defining that port. For example, if thecollective size of the openings in one of the discharge ports exceedsthe collective size of the openings in the other discharge port, moreair will flow to and through the former than the latter. With this inmind, hot spots can be identified in the circuitry provided on thecircuit board 31, and then the location and effective size of eachdischarge port can be selected so as to obtain an air flow pattern inwhich the amount of air flowing past each identified hot spot is morethan would otherwise be the case.

The integrated circuit 37 has a thermally conductive metal plate 56mounted to the top surface thereof, in a manner so that the plate 56 andthe integrated circuit 37 are in thermal communication. In theembodiment of FIG. 1, the plate 56 is secured to the integrated circuit37 using a thermally conductive epoxy, but this could alternatively beeffected in some other suitable manner. A heat pipe 58 of a known typehas one end soldered to the plate 56, and its other end soldered to thetab 42 of the cooling apparatus 41. Alternatively, the heat pipe 58could be thermally coupled to the plate 56 and the tab 42 in some othersuitable manner, for example through use of a thermally conductiveepoxy, or by providing metal parts on the plate 56 and the tab 42 whichcan be crimped around the ends of the heat pipe 58. As still anotheralternative, in order to help keep the housing 12 thin, the coolingapparatus 41 could be mounted on the circuit board 31 at a location nearthe processor integrated circuit 36, a plate such as that shown at 56could be provided on the processor integrated circuit 36, and the heatpipe 58 could extend from the plate on the processor integrated circuitto the cooling apparatus 41.

The integrated circuit 38 has a heat sink 61 mounted on the top surfacethereof, in a manner so that the heat sink 61 and the integrated circuit38 are in thermal communication. In the embodiment of FIG. 1, the heatsink 61 is secured to the integrated circuit 38 using a thermallyconductive epoxy, but it could alternatively be secured in place in anyother suitable manner. The heat sink 61 is made of a metal such asaluminum, or a metal alloy that is primarily aluminum, and has a basewith an array of vertically upwardly extending projections. As airtravels from the cooling assembly 41 along the path 45 to the dischargeport defined by the openings 23, it flows over the heat sink 61 andthrough the projections thereof. Heat generated by the integratedcircuit 38 passes to the heat sink 61, and then from the heat sink 61 tothe air flowing along path 45. The heat sink 61 transfers heat from theintegrated circuit 38 to the air flow 45 at a lower temperature thanwould be the case if the heat sink 61 was omitted and heat had to betransferred directly from the integrated circuit 38 to the air flow.

A wall or vane 63 is provided within the housing 12, and extendsvertically between the circuit board 31 and the underside of the topwall of the housing 12. In the disclosed embodiment, the vane 63 is anintegral part of the housing top wall, and projects downwardly from thetop wall. However, the vane 63 could alternatively be a physicallyseparate part, and could be mounted on the top wall, or on the circuitboard 31. The vane 63 influences the pattern of air which flows from thecooling assembly 41 to the discharge port defined by the openings 23.After one or more hot spots on a given circuit board have beenidentified, one or more vanes of the type shown at 63 can be added, witheach such vane having a size, orientation and location that help toincrease the amount of air flowing past at least one of the hot spots.

FIG. 2 is a diagrammatic fragmentary perspective view which shows thecooling assembly 41 in an enlarged scale, and which also shows in brokenlines the integrated circuit 36 on which the cooling assembly 41 ismounted. The cooling assembly 41 includes a bottom plate 101 which ismade of aluminum or an aluminum alloy, and which has approximately asquare shape, except for an integral projection that extends outwardlyon one side thereof to serve as the tab 42. A top plate 103 is made ofaluminum or an aluminum alloy, and has a square shape which conforms insize to the bottom plate 101. The top plate 103 is supported a smalldistance above the bottom plate 101 by four vertical posts disposed atthe respective corners of the plates 101 and 103, three of these postsbeing visible at 106-108 in FIG. 2. The posts are secured to the plates101 and 103 by welding or brazing, or in any other suitable manner. Thetop plate 103 has a square opening 111 extending vertically through it.The opening 111 is only slightly smaller in size than the plate 103itself, such that the top plate 103 is effectively a square frame.

A plenum 116 of small vertical height is made of aluminum or an aluminumalloy, and in a top view has a square shape which conforms in size tothe square top plate 103. Alternatively, the plenum could be made ofsome other suitable material, such as a polycarbonate material. Theplenum 116 is fixedly secured to the top plate 103, for example bywelding or brazing, by a thermally conductive epoxy, by a thermallyconductive double sided tape of a known type, or in any other suitablemanner. The bottom wall of the plenum 116 has a square opening 117,which is aligned with and has the same size as the opening 111 providedthrough the top plate 103.

The top wall of the plenum 116 has a circular opening 118. A low-profileelectric fan 121 has a relatively small vertical height, has a diametersomewhat greater than the diameter of the opening 118, and is fixedlysecured to the top wall of the plenum 116 so as to be coaxially alignedwith the circular opening 118. When electric current is supplied to thefan 121 through not-illustrated wires, the fan causes air to flowdownwardly through the plenum 116.

The cooling assembly 41 includes, between the top and bottom plates 103and 101, a thermally conductive finstock 141. The finstock 141 isfixedly mounted on the top surface of the bottom plate 101, so as to bein thermal communication therewith. In the disclosed embodiment, thefinstock 141 is secured to the bottom plate 101 by a thermallyconductive epoxy of a known type, but it could alternatively be securedto the bottom plate 101 in any other suitable manner, for example bywelding or brazing. The finstock 141 is described in more detail withreference to FIGS. 3 and 4.

In this regard, FIG. 3 is a diagrammatic top view of the finstock 141,and FIG. 4 is a diagrammatic fragmentary sectional side view of aportion of the finstock 141. With reference to FIG. 3, the finstock 141includes four separate parts 151-154, each of which is approximatelysquare when viewed from the top, except that one outer corner of eachhas a small recess which provides clearance for a respective one of thefour support posts, three of these posts being visible at 106-108 inFIG. 2. The opposite or inner corners of the parts 151-154 are alllocated at a common point disposed along a vertical axis 158, whichextends perpendicular to the plane of FIG. 3. The fan 121 (FIG. 2) andthe opening 118 in the plenum top wall are both concentric to the axis158 (FIG. 3).

The parts 151-154 of the finstock 141 are all identical to each other,and therefore only the part 151 is described here in detail. Withreference to FIG. 3, the part 151 includes an approximately horizontalbase portion 161, and a plurality of parallel fins that each projectvertically upwardly from the base portion 161. The part 151 is made froma thin sheet of an aluminum alloy, which in the disclosed embodiment isan alloy commonly known in the art as Aluminum 3003, and which typicallyincludes 1.2% magnesium with the remainder made of aluminum, althoughthe definition for this alloy allows for magnesium of 1% to 1.5%,silicon less than 0.6%, iron less than 0.7%, copper less than 0.2%, zincless than 0.1%, and other elements less than 0.05%, where all elementother than aluminum and magnesium total less than 0.15%.

The aluminum alloy sheet which serves as the part 151 is bent to havethe cross-sectional shape shown in FIG. 4. However, the part 151 couldalternatively be made of some other suitable material that conducts heatwell. In this regard, the bent aluminum sheet has a plurality ofvertically extending portions that each serve as a sidewall, six ofwhich are visible at 171-176. These sidewalls are arranged in pairs,where the sidewalls of each pair are closely adjacent one another, andare spaced from the sidewalls of other pairs. The bent aluminum sheetalso includes a plurality of top wall portions that each extend betweenthe upper ends of the sidewalls of a respective pair, three of the topwall portions being visible at 181-183. The aluminum sheet furtherincludes a plurality of bottom wall portions that each extend betweenthe lower ends of two sidewalls which are in different pairs, four ofthe bottom wall portions being visible at 186-189.

The bottom wall portions, including those shown at 186-189, collectivelydefine the base 161 (FIG. 3) of the part 151. The sidewall pair 171-172and the top wall portion 181 define a fin 162 (FIG. 3), the sidewallpair 173-174 and the top wall portion 182 define another fin 162, andthe sidewall pair 175-176 and the top wall portion 183 define yetanother fin 162. The sidewalls of each pair are disposed sufficientlyclosely to each other so that there is not enough room between them forany significant flow of air, and thus it is not necessary to formopenings in the top wall portions in order to allow part of the air flowto enter the region between the sidewalls of each pair. The parts151-154 can be fabricated by bending a large aluminum sheet so that ithas the profile shown in FIG. 4, and then cutting the parts 151-154 fromthis large sheet with an abrasive water jet.

Referring again to FIG. 3, it will be noted that the parts 151-154 eachhave one fin which is located approximately in the center thereof, andwhich extends diagonally across that part in a direction substantiallyradially of the axis 158. Each of the other fins on each part 151-154has an inner end which engages the inner end of a respective fin on anadjacent part 151-154. In the disclosed embodiment, the fins 162 of thefinstock 141 have a thickness of approximately 0.006 inch, a verticalheight of 0.25 inch, and a pitch of 18 fins per inch.

In operation, and with reference to FIG. 2, heat produced by thecircuitry within the integrated circuit 36 propagates upwardly from theintegrated circuit 36 to the bottom plate 101 of the cooling apparatus41, and then from the bottom plate 101 into the parts 151-154 of thefinstock 141. The fan 121 draws air into the housing 12 through theopenings 22 that define the intake port, and forces this air to flowdownwardly through the plenum 116 and the opening 111 in the top plate103.

When this downward flow of air reaches the finstock 141, the fins of thefour finstock parts 151-154 cause this air flow to split into portionsthat are redirected to flow in four different horizontal directionsbetween adjacent fins, as indicated diagrammatically by the arrowsprovided around the finstock 141 in FIG. 3. The relative lengths of thearrows in FIG. 3 is a diagrammatic indication of the volume and velocityof air exiting the finstock 141 at each of a number of locations alongthe periphery thereof. By splitting the air flow into portions which areeach redirected to flow in one of four different directions, thefinstock 141 gives the cooling apparatus 41 a very low pressure drop,which facilitates a higher rate of air flow. The low pressure droppermits the fan 121 to drive the desired air flow with minimal effort,thereby minimizing the amount of battery power consumed by the fan,which is always advantageous in a portable computer. Further, the lowpressure drop minimizes the audible noise of the air flow, andfacilitates better cooling.

In this disclosed embodiment, the cooling assembly 41 can dissipate 20watts of heat in a 2 inch×2 inch footprint, with a temperature rise ofabout 15° C. The overall thickness of the cooling assembly is less thanabout 0.4 inch. The power consumption of the fan is only about 2 to 3watts, of which about 0.7 watt relates to cooling of the component 36containing the processor, and the remainder relates to the additionalpressure drop involved in controlling the air flow from the coolingassembly 41 to the openings 22 and 23 that define the discharge ports.The volume of air flow through the cooling assembly 41 is about 3.53cubic feet per minute, and the pressure loss is 0.029 inches of water.

FIG. 5 is a diagrammatic top view similar to FIG. 3, but showing afinstock 241 which is an alternative embodiment of the finstock 141 ofFIG. 3. The finstock 241 is generally similar to the finstock 141,except for differences which are discussed below. In particular, thefinstock 241 includes four parts 251-254, which are generally similar tothe parts 151-154. The primary difference is that, in a top view, theparts 251-254 each have a shape which is approximately a right triangle,rather than a square. The 90° apexes of these triangular parts are alllocated at a common point which is disposed along the vertical axis 158.The other two corners of each part have a small rounded recess thatprovides clearance for a respective one of the four corner posts.

In operation, the finstock 241 splits and redirects the vertical airflow in portions that flow in four horizontal directions, in a mannersimilar to the finstock 141. Further, the finstock 241 has a lowpressure drop, which is comparable to the low pressure drop of thefinstock 141.

As described above with reference to FIGS. 3 and 4, the finstock 141 isfabricated as four separate parts 151-154, each of which is a bent sheetof aluminum. Similarly, the four parts 251-254 of the finstock 241 ofFIG. 5 are each a bent sheet of aluminum. It would alternatively bepossible, in place of the finstock 141 and finstock 241, to use afinstock which is made of some other material that conducts heat well.As one example, a single integral finstock could be made by injectionmolding techniques. In this regard, FIG. 6 is a diagrammatic fragmentarysectional side view of such an injection-molded finstock, which isidentified by reference numeral 341.

The finstock 341 is injection-molded from a thermally conductive moldingmaterial, such as a material having a base polymer which is a thermallyconductive liquid crystalline polymer (LCP) or a thermally conductivepolyphenylene sulfide (PPS). For example, suitable base polymers areavailable commercially under the trademark COOLPOLY from Cool Polymers,Inc. of Warwick, R.I., including LCP product COOLPOLY E2, and PPSproducts COOLPOLY RB020 AND COOLPOLY RS012. The finstock 341 is a singleinjection molded part, rather than several separate sections as in theembodiments of FIGS. 1-5. It will be recognized that, as an alternativeto injection molding, the finstock 341 could be formed by resin transfermolding.

As a further not-illustrated alternative, if the finstock is molded (forexample as shown at 341), then the top plate 103 can optionally beomitted, and the plenum 116 can be directly secured to the tops of thefins of finstock 341, for example using a suitable known epoxy adhesive.In that case, it is possible to optionally omit the four support posts(three of which are visible at 106-108). As still another alternative, amolded finstock could be similar to that shown at 341 in FIG. 6, exceptthat the top plate 103 could be fabricated as an integral part of themolded finstock 341, and the plenum 116 could be directly secured to theintegral top plate.

FIG. 7 is a diagrammatic fragmentary perspective view similar to FIG. 2,but showing a cooling assembly 441 which is an alternative embodiment ofthe cooling assembly 41 of FIG. 2. The cooling assembly 441 is identicalto the cooling assembly 41, except for the difference which is discussedbelow. More specifically, the finstock 141 of the assembly 41 has beenomitted in the assembly 441, and an approximately rectangular block 444of porous material is provided in its place. The block 444 extendsvertically from the bottom plate 101 to the top plate 103, and isphysically and thermally secured to the bottom plate 101 by welding,brazing or a thermally conductive epoxy, or in some other suitablemanner.

The porous block 444 is made from a porous open-cell sintered materialwhich is heat conductive, but it could alternatively be made from aporous open-cell foamed material which is heat conductive. In thisdisclosed embodiment, the sintered or foamed porous material used forthe block 444 is aluminum, but it could alternatively be some othersuitable heat-conductive material. The porous block 444 is relativelyinexpensive. The downward air flow from the fan 121 enters the centralportion of the porous block 444, and then flows horizontally outwardlythrough the block 444 in a variety of different radial directions.

As discussed above, the finstock 341 of FIG. 6 is an injection moldedpart of a synthetic material. As another alternative, the finstock couldbe made from some other heat-conductive material that is amenable tocasting or molding, such as a die-cast zinc alloy. In this regard, FIG.8 is a diagrammatic top view of a finstock 541 which is a die-cast partmade of a zinc alloy, which is an alternative embodiment of the finstock141 of FIGS. 2 and 3, and which can be substituted for the finstock 141in the cooling assembly 41 of FIG. 2. The finstock 541 has horizontaldimensions of about 2 inches by 2 inches, with the base plate about 0.05inch thick and the fins about 0.25 inch high. There are about 16 finsper inch, and the fins have rounded tips.

The fins increase in thickness from the tip to the base, with athickness of about 0.01 inch near the tip and about 0.025 inch near thebase. Between each adjacent pair of fins, the top surface of the base isslightly rounded, so as to be concave. The zinc alloy used for thefinstock 541 is an alloy commonly known as zinc die-casting Alloy 3,which includes 3.5% to 4.3% aluminum, a maximum of 0.25% copper, 0.02%to 0.05% magnesium, a maximum of 0.1% iron, a maximum of 0.005% lead, amaximum of 0.004% cadmium, and a maximum of 0.003% tin, with the balancebeing zinc. Of course, these specific dimensions and specific alloygiven above for the finstock 541 are exemplary, and it will berecognized that variations of the dimensions and the material arepossible without departing from the scope of the present invention.

The present invention provides a number of technical advantages. Onesuch technical advantage results from the provision within a portablecomputer of a low-profile cooling assembly for a circuit component suchas the processor. In one advantageous configuration, the coolingassembly effects a forced flow of air drawn from externally of thehousing, and the air flow from this cooling assembly is routed withinthe housing to facilitate cooling of other heat-dissipating components.The routing of this air flow is facilitated by techniques which includeselection of the number of discharge ports through which the air flowexits the housing, and selection of the location and/or effective sizeof each such discharge port. The routing of the air flow can also befacilitated by the use of strategically placed vanes within the housing.

A related advantage is realized where a component has a local finnedheat sink in order to facilitate the efficient transfer of heat fromthat component to the air flow which is traveling from the coolingassembly to a discharge port. Still another advantage is realized wherea heat pipe is provided within the housing to help transfer heat, forexample from a heat dissipating component to the cooling assembly.Through use of such techniques, a portable computer can be relativelythin and lightweight, and can have a processor which operates at itshighest rated speed, while enjoying efficient cooling through use of aconfiguration that consumes minimal power.

In an advantageous configuration, the cooling assembly uses a forced airflow which is split to flow through a thermally conductive section inseveral significantly different directions. One such thermallyconductive section is a block of porous material. A different thermallyconductive section is a finstock which splits the airflow into portionsflowing in multiple directions. Splitting the air flow yields a lowpressure drop, which facilitates low power consumption and minimalaudible noise for the cooling assembly. Further, it is effected with afinstock that has a relatively low height but provides a large surfacearea that offers a high degree of convective heat transfer. Anotheradvantage is that the cooling assembly achieves these advantages eventhough it has a very low profile which, when used in a portablecomputer, permits the housing of the computer to be relatively thin.

Although selected embodiments have been illustrated and described indetail, it will be understood that various substitutions and alterationsare possible without departing from the spirit and scope of the presentinvention, as defined by the following claims.

1. An apparatus comprising a portable computer which includes: ahousing; circuitry disposed within said housing and having a component;and a temperature adjusting arrangement thermally coupled to saidcomponent, said temperature adjusting arrangement including: a thermallyconductive section having a side which faces in a directionapproximately parallel to an axis, and which is thermally coupled tosaid component; and a fluid supply section disposed on a side of saidthermally conductive section opposite from said component and operableto direct a fluid flow along said axis toward said thermally conductivesection, said thermally conductive section causing said fluid flow tosplit into a plurality of flow portions which each flow through saidthermally conductive section in a direction approximately parallel to aplane perpendicular to said axis.
 2. (canceled)
 3. (canceled) 4.(canceled)
 5. (canceled)
 6. (canceled)
 7. (canceled)
 8. (canceled) 9.(canceled)
 10. (canceled)
 11. (canceled)
 12. (canceled)
 13. (canceled)14. (canceled)
 15. (canceled)
 16. (canceled)
 17. (canceled) 18.(canceled)
 19. (canceled)
 20. (canceled)
 21. (canceled)
 22. (canceled)23. (canceled)
 24. (canceled)